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Online ISSN: 2578-3769


Recent Advances in Organic-inorganic Hybrid Photoresists
Authors: Zhihao Wang, Xindi Yao, Huiwen An et al.
Institution:Key Laboratory of Photochemical Conversion and Optoelectronic Materials, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, China
Keywords:Organic-inorganic hybrid photoresist;EUV lithography;nanocluster;nanoparticle;organometallic complex
Volume 4, Issue 1: 21040101, 2021 | PDF
Research Article
Published: March 28, 2021
Abstract: Photoresists are radiation-sensitive materials used for forming patterns to build up IC devices. To date, most photoresists have been based on organic polymers, which have been dominating the semic...
Silicon Nitride Etch via Oxidation Reaction in Fluorocarbon/Oxygen Plasma: A First-Principle Study
Authors: Yu-Hao Tsai, Du Zhang, Mingmei Wang
Institution:TEL Technology Center
Keywords:3D-NAND;oxide;nitride;oxynitride;plasma etch;first-principle
Volume 1, Issue 1: 18010102, 2018 | PDF
Research Article
Published: Sept. 30, 2018
Abstract: Conducting all-in-one etch process for 3D-NAND fabrication requires close etch rate (E/R) for SiO2 and Si3N4; however, to attain comparable and high etch rate for b...
A Novel High Volume Manufacturing Method for Defect-free and High-yield SiN Micro-sieve Membranes
Authors: Yansong Liu, Chao Zhao, Lisong Dong et al.
Institution:Key Laboratory of Microelectronic Devices, &, Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences
Keywords:micro-sieves;high volume manufacturing;defect free;high yield
Volume 1, Issue 1: 18010103, 2018 | PDF
Research Article
Published: Sept. 30, 2018
Abstract: Micro-sieves have been widely used in medical treatment, quarantine, environment, agriculture, pharmacy and food processing. However, the manufacturing and yield improvement have been difficult due...