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EUV Lithography: State-of-the-Art Review 38
Study of Inverse Lithography Approaches based on Deep Learning 28
Recent Progress of the Integrated Circuit Industry in China ― Overview of the Manufacturing Industry 13
Recognition and Visualization of Lithography Defects based on Transfer Learning 9
Key Process Approach Recommendation for 5 nm Logic Process Flow with EUV Photolithography 8
EUV Lithography: State-of-the-Art Review 624
The 2017 IRDS Lithography Roadmap 96
A Photolithography Process Design for 5 nm Logic Process Flow 84
Metrology Challenges in 3D NAND Flash Technical Development and Manufacturing 69
Key Process Approach Recommendation for 5 nm Logic Process Flow with EUV Photolithography 59
EUV Lithography: State-of-the-Art Review 909
The 2017 IRDS Lithography Roadmap 171
Current Status of the Integrated Circuit Industry in China ― IC Special Equipment Industry 91
A Photolithography Process Design for 5 nm Logic Process Flow 84
Silicon Nitride Etch via Oxidation Reaction in Fluorocarbon/Oxygen Plasma: A First-Principle Study 81
Current Status of the Integrated Circuit Industry in China ― Overview of the Memory Industry 572
EUV Lithography: State-of-the-Art Review 500
The 2017 IRDS Lithography Roadmap 257
Current Status of the Integrated Circuit Industry in China ― IC Manufacturing Industry 255
Study of Inverse Lithography Approaches based on Deep Learning 250
EUV Lithography: State-of-the-Art Review 6849
The 2017 IRDS Lithography Roadmap 2884
An Innovative Method to Improve Model Accuracy by Implementing Multi-models Scheme for 28nm Node and Below 2679
Current Status of the Integrated Circuit Industry in China ― IC Manufacturing Industry 2587
A Photolithography Process Design for 5 nm Logic Process Flow 2442
EUV Lithography: State-of-the-Art Review 9134
Current Status of the Integrated Circuit Industry in China ― IC Special Equipment Industry 8795
Current Status of the Integrated Circuit Industry in China —— IC Design Industry 8589
The 2017 IRDS Lithography Roadmap 3846
Current Status of the Integrated Circuit Industry in China ― IC Manufacturing Industry 3318
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Current Issue Archive Special Issue Advanced Search
Patterning with Organized Molecules
Authors: Mark Neisser
Institution：Tan Kah Kee Innovation Laboratory
Keywords：Stochastics；Self-assembly；overlay；edge placement error；self-organizing；DNA origami；bottle brush polymers
doi：10.33079/jomm.21040202
Volume 4, Issue 2: 21040202, 2021 | PDF
Research Article
Published: Aug. 9, 2021
 Views：250
Details
Abstract： Decades of progress in the semiconductor industry has led to lithographically printed dimensions that are small enough that the positions of individual molecules and the stochastic variation in the...
Silicon Nitride Etch via Oxidation Reaction in Fluorocarbon/Oxygen Plasma: A First-Principle Study
Authors: Yu-Hao Tsai, Du Zhang, Mingmei Wang
Institution：TEL Technology Center
Keywords：3D-NAND；oxide；nitride；oxynitride；plasma etch；first-principle
doi：10.33079/jomm.18010102
Volume 1, Issue 1: 18010102, 2018 | PDF
Research Article
Published: Sept. 30, 2018
 Views：3786
Details
Abstract： Conducting all-in-one etch process for 3D-NAND fabrication requires close etch rate (E/R) for SiO2 and Si3N4; however, to attain comparable and high etch rate for b...
A Novel High Volume Manufacturing Method for Defect-free and High-yield SiN Micro-sieve Membranes
Authors: Yansong Liu, Chao Zhao, Lisong Dong et al.
Institution：Key Laboratory of Microelectronic Devices, &, Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences
Keywords：micro-sieves；high volume manufacturing；defect free；high yield
doi：10.33079/jomm.18010103
Volume 1, Issue 1: 18010103, 2018 | PDF
Research Article
Published: Sept. 30, 2018
 Views：1913
Details
Abstract： Micro-sieves have been widely used in medical treatment, quarantine, environment, agriculture, pharmacy and food processing. However, the manufacturing and yield improvement have been difficult due...

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