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Recent Progress of the Integrated Circuit Industry in China ― Overview of the Manufacturing Industry
Authors: Litho World
Keywords:IC Industry;Manufacturing Industry
doi:10.33079/jomm.20030304
Issue 3: 20030304, 2020 | PDF
Published: Oct. 8, 2020
Views:35
Abstract: China's IC industry has been flourishing in recent years, huge market demand together with government investments are the major driving forces for this development. The status and development momen...
Study on Simulation and Profile Prediction of Atomic Layer Deposition
Authors: Lei Qu, Chen Li, Jiang Yan et al.
Institution:North China University of Technology
Keywords:Atomic Layer Deposition;process simulation;profile model;temperature fitting;film of HfO2
doi:10.33079/jomm.20030303
Issue 3: 20030303, 2020 | PDF
Research Article
Published: Oct. 8, 2020
Views:37
Abstract: The Atomic Layer Deposition process (ALD) is widely used in FinFET, 3D-NAND and other important technologies because of its self-limiting signature and low growth temperature. In recent years, the ...
Study of Inverse Lithography Approaches based on Deep Learning
Authors: Xianqiang Zheng, Xu Ma, Shengen Zhang et al.
Institution:Key Laboratory of Photoelectronic Imaging Technology and System of Ministry of Education of China, School of Optics and Photonics, Beijing Institute of Technology, China
Keywords:Computational lithography;inverse lithography technology (ILT);optical proximity correction (OPC);deep learning
doi:10.33079/jomm.20030301
Issue 3: 20030301, 2020 | PDF
Research Article
Published: Oct. 7, 2020
Views:119
Abstract: Computational lithography (CL) has become an indispensable technology to improve imaging resolution and fidelity of deep sub-wavelength lithography. The state-of-the-art CL approaches are capable o...
Recognition and Visualization of Lithography Defects based on Transfer Learning
Authors: Bo Liu, Pengzheng Gao, Libin Zhang et al.
Institution:School of Information, North China University of Technology, Beijing
Keywords:transfer learning;neural network;lithography defects;visualize;Grad-CAM
doi:10.33079/jomm.20030302
Issue 3: 20030302, 2020 | PDF
Research Article
Published: Oct. 5, 2020
Views:74
Abstract: Yield control in the integrated circuit manufacturing process is very important, and defects are one of the main factors affecting chip yield. As the process control becomes more and more critical ...
High-Pressure Oxidation on Ge: Improvement of Ge/GeO2 Interface and GeO2 Bulk Properties
Authors: ChoongHyun Lee
Institution:Zhejiang University
Keywords:High-pressure oxidation;Ge oxidation;High mobility channel;Ge/GeO2 interface;Interface trap density
doi:10.33079/jomm.20030202
Issue 2: 20030202, 2020 | PDF
Published: June 29, 2020
Views:613
Abstract: On the basis of thermodynamic and kinetic consideration of Ge-O system, high-pressure oxidation (HPO) on Ge was proposed to suppress the GeO desorption during the thermal oxidation and significant ...
Issue 2: 20030203, 2020 | PDF
Research Article
Published: June 29, 2020
Views:599
Abstract: China's IC industry has been flourishing in recent years, huge market demand together with government investments are the major driving forces for this development. The status and development momen...
FinFET Performance Enhancement by Source/Drain Cavity Structure Optimization
Authors: Man Gu, Wenjun Li, Haiting Wang et al.
Institution:GLOBALFOUNDRIES Inc. US
Keywords:FinFET performance;parasitic resistance and capacitance;source/drain cavity;cavity implant
doi:10.33079/jomm.20030201
Issue 2: 20030201, 2020 | PDF
Published: June 8, 2020
Views:966
Abstract: Fin field-effect transistor (FinFET) technology has been introduced to the mainstream complementary metal-oxide semiconductor (CMOS) manufacturing for low-power and high-performance applications. H...
Current Status of the Integrated Circuit Industry in China ― Overview of Semiconductor Materials Industry
Authors: Litho World
Keywords:IC Industry;Material lndustry
doi:10.33079/jomm.20030106
Issue 1: 20030106, 2020 | PDF
Research Article
Published: March 30, 2020
Views:1213
Abstract: China's IC industry has been flourishing in recent years, huge market demand together with government investments are the major driving forces for this development. The status and development momen...
A Device Design for 5 nm Logic FinFET Technology
Authors: Yu Ding, Yongfeng Cao, Xin Luo et al.
Institution:Shanghai Integrated Circuit Research and Development Center, No, ., 497, Gaosi Road, Pudong New Area, Shanghai
Keywords:5nm FinFET;brief process flow;key dimensions;simulated device DC/AC performance;RO PPA performance
doi:10.33079/jomm.20030105
Issue 1: 20030105, 2020 | PDF
Research Article
Published: March 30, 2020
Views:1006
Abstract: With the continuous scaling in conventional CMOS technologies, the planar MOSFET device is limited by the severe short-channel-effect (SCE), Multi-gate FETs (MuG-FET) such as FinFETs and Nanowire, N...
A Study of 2D Assist Feature Placement
Authors: Liang Zhu, Barry Ma, Lin Shen et al.
Institution:Synopsys Inc., 1027 ChangNing Road, Shanghai, China, 200050
Keywords:Assist Feature;Inverse Lithography Technology;Low K1 Lithography;Machine Learning
doi:10.33079/jomm.20030104
Issue 1: 20030104, 2020 | PDF
Research Article
Published: March 30, 2020
Views:1189
Abstract: Sub-resolution assist features have been widely recognized in lithography patterning. In general, the insertion of assist features in optically adjacent space around main designed features, will ch...