@Article{jomm.19020203,
AUTHOR = {Yu Zhang; Abhishek Vikram; Ming Tian; Tianpeng Guan; Jianghua Leng; Baojun Zhao; Lei Yan; Wei Hu; Guojie Chen; Hui Wang; Gary Zhang; Wenkui Liao},
TITLE = {Patterning Defect Study for Process Integration Engineering Using Pattern Fidelity Monitoring with Review SEM Images},
JOURNAL = {Journal of Microelectronic Manufacturing},
VOLUME = {2},
YEAR = {2019},
PAGES = {19020203},
URL = {http://www.jommpublish.org/p/183/28/},
DOI = {10.33079/jomm.19020203}
}